RRP Electronics signs MoU with Deca Technologies to acquire wafer-level chip packaging capability 

Semiconductor firm RRP Electronics Ltd. has entered into a MoU with U.S.-based Deca Technologies, Inc. to acquire the latter’s wafer-level packaging capabilities. “This partnership marks a significant milestone in India’s journey to becoming a global semiconductor powerhouse,” RRP Electronics said.

Under the MoU, RRP Electronics, which has expertise in assembling and testing semiconductor components, will integrate Deca’s Wafer-Level Chip Scale Packaging (WLCSP) and M-Series Fan-Out Wafer-Level Packaging (FOWLP) technologies into its processes. This will enhance RRP’s ability to deliver high-performance semiconductor solutions to customers worldwide, it said. Deca Technologies is backed by Qualcomm, Infineon, and ASE Group.

Rajendra K. Chodankar, Chairman & CEO, RRP Electronics said, “We are investing in a large-scale Technology Transfer License Agreement (TTLA) with Deca, potentially on exclusive terms, to create a fully automated, world-class infrastructure.” “This partnership will take semiconductor packaging in India to new heights. We aim to complete our qualification tests by August 2025 and foresee revenue exceeding $30 million (about ₹260 crore) in just the second year of operations, with exponential growth in the years to come,” he said. RRP would make an investment of $150 million in this project.

Tim Olson, Founder & CEO, Deca Technologies said, “RRP Electronics’ vision, expertise, and determination make them the perfect partner to drive innovation in semiconductor packaging. This collaboration will accelerate their ambitious plans and strengthen India’s position in the global semiconductor value chain.”