Baidu US$618 million dim sum bond will bolster AI ambitions amid weak results



Chinese search engine giant Baidu will issue a 4.4 billion yuan (US$618 million) dim sum bond aimed at securing lower financing costs and operational flexibility amid an aggressive artificial intelligence expansion.

The bond carries an annual coupon of 1.9 per cent and will mature in 2029. Baidu priced the bond on Tuesday, with the offering expected to close on or about September 15, 2029.

It is the second dim sum bond – denominated in yuan and issued outside mainland China – that the company has sold and follows a previous issuance in March which raised 10 billion yuan through two tranches: 7.5 billion in 5-year bonds and 2.5 billion yuan in 10-year bonds.

Baidu is among a growing group of issuers taking advantage of relatively low Chinese interest rates and increased demand from investors seeking alternatives to US dollar assets.

As of late August, issuers sold a record US$43.8 billion in dim sum bonds this year, according to Bloomberg, with many expecting Chinese offshore debt to reach further records by year-end.

The issuance comes as Baidu last month reported weak second quarter earnings.

Its total revenue dropped 2 per cent to 26 billion yuan and net profit fell 34 per cent to 4.8 billion yuan, compared with a year earlier.

  • Related Posts

    Hong Kong export credit insurer keeps premiums low despite Middle East tensions

    Hong Kong’s export credit insurer is keeping premiums low and expanding support for small and medium-sized enterprises (SMEs), even as geopolitical tensions in the Middle East raise concerns about risks…

    Continue reading
    Chinese firms should focus on investing in politically stable regions: entrepreneur

    Chinese firms should prioritise regional political stability when they make overseas investment decisions, as mounting geopolitical tensions and currency fluctuations increase the risks of doing business abroad, a prominent Chinese…

    Continue reading

    Leave a Reply

    Your email address will not be published. Required fields are marked *